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Seimyuing Vactron

UV exposure, UV curling machine, Laminator, UV lamp, UV LED lamp
Name

Wafer-Bonding UV Curing Machine

Model SSCM-M3K1/PR
Series UV Curing
Product Description

Motivation for Development
This curing machine is designed to be used in the process for fastening and unfastening wafers in the semiconductor wafer-processing CMP process. 

Main Use : For semiconductor wafer-processing process 

Product Features
① Allow for free use of various sizes of wafers 
② Capable of processing multiple wafers. 
③ Permit the processing of light irradiation conditions by channels according to the conditions of wafers 
④ No adhesive residues (chips) left so that adhesion after the processing of wafers can be easily removed
⑤ There are variable types of scan and irradiation distance, all of which can be applied to wafers with various specifications. (Mainly 8- and 10-inch wafers)
⑥ This is the semi-automatic batch type which processes products in an independent chamber.
⑦ Realize the out-gas system and cleam chamber by adopting the N2 purge system
⑧ Achieve high-efficiency UV flux and high-level beam uniformity
⑨ Display the status of the system through various indicators 

Main Specifications

Seimyuing Vactron Wafer-Bonding UV Curing Machine SSCM-M3K1/PR

Products of Seimyuing Vactron