Motivation for Development
Because stepped levels of the product and three-dimensional shape of patterns take engraved and embossed shapes, general PCB substrates have the air space generated between the product and DFR films in the rounding section. If the air space is exposed to light, light disperses and distorts pattern shapes. This equipment has been developed to laminate DFR, without the air space, by enhancing close adhesion.
Main Use : FPCB manufacturers, and for laminating products whose materials are curved
Product Features
① This equipment is the DF lamination equipment for PCB- or FPCB-stepped substrate (MLB) and thin plates.
② Maximize close adhesion due to the specifications of the high-strength roller and the improvement of the pressurization method.
③ Secure the temperature uniformity (within 10%) and apply the precision of control
④ Secure the stability of lamination due to the improvement in tension adjustment of film chucks
⑤ Easy to exchange (mount and dismount) because the exchange of the roller is made possible on the front.
Main Specifications
