Product Description
This system has remove the laminating tape of Wafer Pattern surface and apply to 5,6,8 inch of wafer Size.
Specification
| Model | SM - DL1001 |
| Wafer Size | 5, 6 , 8 Inch |
|
Tape Size |
~60 mm(width) |
| Wafer thickness | MIn 3 mil(0.07mm) |
| Processing | Visual C , Window Base |
| UPH |
60 wafer/hr |
| Dimension | 1440(L) x 1700(H) x 1440(W) mm |
| Power | Power : 220V AC 3 – P 50/60 Hz |
| Air | Air : 5 ~ 7 Kg/㎠ |
