Product Description
This equipment included in the cassette for the Solar Cell Wafer Plating to work on Tray Loading and after the Plating operation then unloading wafer in Tray move to the Cleaning equipment .
Specification
Work Scop |
Solar Wafer |
System Size |
Approx. Loader 1100(W) x 1000(L) x 1400(H), Unloader 1500(W) x 1700(L) x 1500(H), |
Tact Time |
10sec/12Wafer |
Application Size |
Wafer Size ; 125 x125mm |
Stroke |
Loader / X-Axis 750mm, Y-Axis 135mm, Z-Axis 50mm Unloader / X-Axis 1255 mm, Y-Axis 135mm, Z-Axis 150mm |
Control |
Controller : PLC & Motion Controller, UI : Touch Screen |
Loading Accuracy |
± 0.5 mm |
Utility |
Power 220V 3Φ 60Hz, Air pressure 4~6bar |