Product Description
Manual Tape lamination system is a Semiautomatic tape mounter to setting the wafer and frame manually.
Specification
| Wafer Size | 8 , 12 Inch |
| Dimension | 1000(L) * 650(W)*500(H) mm |
| Power | 220V AC 1P 50/60 Hz |
| Weight | 40 |
| Air | 5 ~ 7 kg/㎠ |
Feature
- 8”, 12” Wafer Capability ( no conversion )
- Contact Vacuum porous Chuck (Non-Contact chuck ,option)
- Air bubbles free mounting.
- Bonding pressure controllable(air pressure adjust)
- Bonding speed controllable(speed control motor driven)
- Blade Cutter unit : Manual (rotating type)
- Ionizer
- Non UV & UV Tape allowable.
- Wafer chuck temp controllable : up to 100℃
