Product Description
BGA material defects immediately after the test that you can Reject Marking System
Specification
| Item | Description | Remark | |
| MODEL | SM – FDM1000 | ||
| Work | PCB | BGA, CSP, FPCB, Matrix Strip | |
| Max. Size | 300(L) x 100(W) mm | ||
| Thickness | 0.2 ~ 0.8 mm | ||
| Inspection | Visual | Microscope (10X ~ 63X) | |
| Auto Zoom, Vision Camera | Option | ||
| AFVI I/F | Inspection Data I/F | ||
| Inkjet Marking | Ink | Non-UV ink (Solvent Ink) | Fast |
| Resolution | 200 DPI | ||
| Mark Size | 0.6 mm ~ 17 mm | ||
| Mark Font | TTF, Bitmap | ||
| Marking Speed | Max 60m/min | ||
| System | Stage | X, Y Axis - Servo Motor driven | |
| Dimension | 1,200(W) x 850(D) x 700(H) mm | ||
| Operating | PC Based Monitor | ||
| Utility | Power | 220V 50/60Hz 15A | |
| Air | 4 ~ 6 Kg/cm 2 | CDA | |
| Vacuum | -300 mmHg, 24L/min | ||
Feature
- No pollution
- Directly after the test without a scratch marking marking
- Thin, thick and fast ink drying time
- Less than 20um thick ink, UV Lamp No need
- Auto-Marking: AFVI Inspection Data I / F
