TSD CVD

Time Space Divided Chemical Vapor Deposition

•World’s First and Best Technology
•Enable ultra-fine process through time and space split

[KEY BENEFITS]

- Enable simultaneous space and time split for the first time in the world
- Form dense film with zero plasma damage through space and time split
- Applicable to various processes including CVD and ALD, Nitridation, Oxidation, and Doping
- Excellent film quality, and wide process window

[KEY APPLICATIONS]

- High-K
- Metal
- SiO / SiOC / SiON
- SiN / SiBN
- Oxidation
- Nitridation