DRY ETCH

•Unique tuning knob for uniformity
•High selectivity
•Lowest CoO in the world

[KEY BENEFITS]

- Applicable to all processes including poly and metal
- Minimize wafer damage while maintaining etching quantity at an equal level
- Improve CDU through precise adjustments up to the wafer edge
- Low maintenance cost and stability, high mass-productivity

[KEY APPLICATIONS]

- DPT Partition Etch
- STI & Gate Etch
- Hard Mask Etch & Poly Etch Back
- MTJ Etch