SDP CVD (CVD & ALD)

Space Divided Plasma Chemical Vapor Deposition

•World’s First and Best Technology
•Technology to maximize unit production through space split and semi-batch
•New concept zero-damage plasma technology
•Technology to form high-quality thin film at low temperature

[KEY BENEFITS]

- New concept semiconductor manufacturing equipment that can handle the entire deposition process
- Form the best film quality at temperatures lower than 300 degrees centigrade without substrate damage due to plasma
- Handle all CVD and ALD processes of silicon oxide film, silicon nitride film, metal film, and the High-K process at fine semiconductor process below 20nm
 

[KEY APPLICATIONS]

- High-K
- Metal 
- SiO / SiOC / SiON
- SiN / SiBN
- Oxidation
- Nitridation