Product Name : AIW50(E-Beam Micro Joining)
Features : AIW50(E-Beam Micro Joining)
Features
The world's first designed Hybrid Sub-Micron Joining System. It is also applicable to Nano welding(Customer-Fit-Product).
1) SEM Mode by A few Nano Sized reolution.
2) Sub-micron Sized E-beam Joining Mode - (Max.Ip ≥ 100uA)
3) Possible customizing application like chamber, stage, pump, loadlock and etc.
4) Compact Size & low keV Electron Gun.
5) Possible Manipulator attachment in Chamber.
6) Possible process observation by using BSE detector
Specifications
Gun Specification
1) Source Tungsten Hair-Pin Filament(LaB6 Available)
2) Low Power & High Performance
3) Fast response system for preventing welding
4) High welding quality and welding repeatability,
5) Possibility of gun mounting on a robotic manipulator
6) Voltage power 35KeV (Max. 40KeV)
7) Beam current max. 50uA(Guaranty) - (Max Ip ~100uA for macro joining)
8) Seam Tracking with BSE detector - Cooling System prevent damage from thernal-electron
Application
1) E-beam Micro Joining with surface cleanness
2) Quality welding of metal with high reflexibility Ag, Cu, etc.
3) Micro Metal Powder Melting ; Ti, Al, Cobalt-Chrome, Alloy powder, etc.
4) Fine and complicated structure SOS (System on Chip), Precision Valve
5) Wetting/Joining for CPU Casing, Gas Sensor
6) Precision parts welding for Aircraft, Automobile industry, Aerospace and Power Engineering.
7) Fine Orthopedic Implants and e-beam sintering
