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Yujin Discom

LCD, OLED, PDP, VFD, Touch Panel Semi conductor equipment
Name

Semi COG Bonder (2Head)

Series Module Line
Product Description

This machine is to bond the IC chip on the LCD glass. IC chip supplied automatically from the tray by robot arm. LCD glass loading is manual, alignment and IC chip bonding is automatic. (ACF bonding process should be done with ACF bonding machine.)

 

SPECIFICATIONS

EQUIP. DIMENSION

1160(L)mm×840(W)mm×1690(H)mm

WEIGHT

500Kg

IC CHIP SIZE

4~23mm(L), 1.0~5mm(W)

GLASS SIZE

1.0” ~ 7.0”

PATTERN PITCH

38 ㎛ (25㎛ 2 line )

BONDING ACCURACY

±5 ~ 6 ㎛

TACKTIME(1 IC BONDING)

9~12sec

AILGNMENT

Vision System (Auto Alignment)

BONDING HEAD

2 Head

UTILITY

MAIN POWER:220V±10%, 2.0KW, 50/60Hz

AIR : 5~6 Kg/cm2, 250L/min, Ø8 Hose