This machine is to bond the IC chip on the LCD glass. IC chip supplied automatically from the tray by robot arm. LCD glass loading is manual, alignment and IC chip bonding is automatic. (ACF bonding process should be done with ACF bonding machine.)
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| Name |
Semi COG Bonder (2Head) |
| Series | Module Line |
Product Description
Products of Yujin Discom
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Cell Line
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Auto Scribe (4Head)
Cell Line
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Single Scribe
Cell Line
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Filling Machine (Oil Pump)
Cell Line
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END Seal Machine (3Head)
Cell Line
-
Cell Cleaning Machine (7Sump)
Cell Line
-
Large Machine
-
Polarizer Attach Machine (47")
Large Machine
-
TAB Bonder (47")
Large Machine
-
PCB Bonding Machine (47")
Large Machine
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Semi COG Bonder (24")
Large Machine
-
Auto TAB Bonder (15")
Large Machine
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Module Line
-
Polarizer Cutting Machine
Module Line
-
Auto Polarizer Attach Machine
Module Line
-
Auto Polarizer Attach Machine (10.4")
Module Line
-
Polarizer Attach Machine
Module Line
-
Auto Visual Tester (AVT)
Module Line
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Auto Clave (Ø550, Ø820)
Module Line
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ACF Bonder
Module Line
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Semi COG Bonder (2Head)
Module Line
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FPC Bonder (R-L)
Module Line
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FPC Bonder 4H-4S (R-L)
Module Line
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FPC Bonder (Turn) 1H-2S
Module Line
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FPC Bonder (Turn) 2H-4S
Module Line
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Auto LCM Assembly Machine
Module Line
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The 1st Part Process
-
Seal Cure
The 1st Part Process
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TSP Line
-
Assembly Rolling Machine
TSP Line
-
Cell Laminator
TSP Line
-
Guide Hole Cutter
TSP Line
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OCA Attach Machine
TSP Line
-
Sheet Assembly Machine
TSP Line