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Yujin Discom

LCD, OLED, PDP, VFD, Touch Panel Semi conductor equipment
Name

FPC Bonder 4H-4S (R-L)

Series Module Line
Product Description

This machine is to bond the ACF attached panel with manually aligned FPC film by heat and pressure. (Left-Right moving type, 4 head / 4 moving stage)

 

SPECIFICATIONS

EQUIP. DIMENSION

1330(L)mm×650(W)mm×1735(H)mm

WEIGHT

550Kg

LCD GLASS SIZE

30~45(W),  20~45(L)

LCD GLASS THICKNESS

(0.3~1.1)*2mm

PATTERN PITCH

50 ㎛ (max)

1 FPC BONDING TIME(S/T)

9~10SEC (BONDING TIME 13SEC시)

BONDING ACCURACY

±7~10 ㎛

TEMPERATURE

Room Temperature ~ 350℃ (controller 상)

CAMERA SYSTEM

Magnification:80~150(12“CRT Monitor),
F.O.V (field of view) : X=1.5~3mm
Working Dist.:75~110mm,Inter CCD adjustment:12~50mm

UTILITY

MAIN POWER:220V±10%,2.0KW, 50/60Hz

AIR : 5~6 Kg/cm2, 600L/min, Ø8 Hose