본 설비는 LCD GLASS 위에 IC Chip을 부착하는 설비이다. IC Chip은 Robot에 의해 Tray에서 자동 공급되며 LCD GLASS Loading Unloading을 수동으로 하면 Alignment에서 IC Chip Bonding까지 자동으로 작업한다.
|
|||||||||||||||||||||||||||
| Name |
Semi COG Bonder (24") |
| Series | Large Machine |
Product Description
Products of Yujin Discom
-
Cell Line
-
Auto Scribe (4Head)
Cell Line
-
Single Scribe
Cell Line
-
Filling Machine (Oil Pump)
Cell Line
-
END Seal Machine (3Head)
Cell Line
-
Cell Cleaning Machine (7Sump)
Cell Line
-
Large Machine
-
Polarizer Attach Machine (47")
Large Machine
-
TAB Bonder (47")
Large Machine
-
PCB Bonding Machine (47")
Large Machine
-
Semi COG Bonder (24")
Large Machine
-
Auto TAB Bonder (15")
Large Machine
-
Module Line
-
Polarizer Cutting Machine
Module Line
-
Auto Polarizer Attach Machine
Module Line
-
Auto Polarizer Attach Machine (10.4")
Module Line
-
Polarizer Attach Machine
Module Line
-
Auto Visual Tester (AVT)
Module Line
-
Auto Clave (Ø550, Ø820)
Module Line
-
ACF Bonder
Module Line
-
Semi COG Bonder (2Head)
Module Line
-
FPC Bonder (R-L)
Module Line
-
FPC Bonder 4H-4S (R-L)
Module Line
-
FPC Bonder (Turn) 1H-2S
Module Line
-
FPC Bonder (Turn) 2H-4S
Module Line
-
Auto LCM Assembly Machine
Module Line
-
The 1st Part Process
-
Seal Cure
The 1st Part Process
-
TSP Line
-
Assembly Rolling Machine
TSP Line
-
Cell Laminator
TSP Line
-
Guide Hole Cutter
TSP Line
-
OCA Attach Machine
TSP Line
-
Sheet Assembly Machine
TSP Line