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Yujin Discom

LCD, OLED, PDP, VFD, Touch Panel Semi conductor equipment
Name

FPC Bonder (Turn) 2H-4S

Series Module Line
Product Description

This machine is to bond the ACF attached panel with manually aligned FPC film by heat and pressure. Turn type and 2 head/ 4 stage type. 
 

1. 4 turning stage and 2 bonding head installed.
2. Pressure and temperature is maintained evenly.
3. Use the micro speed cylinder to control the pressure precisely.
4. Compact machine size.
5. Zoom type CCD camera applied for various FPC
 

SPECIFICATIONS

EQUIP. DIMENSION

1100(W)mm×670(L)mm×1830(H)mm

WEIGHT

550Kg

PANEL SIZE

1.5 ~ 3.5 inch

PANEL THICKNESS

(0.3x~1.1)x2mm

PATTERN PITCH

80㎛(Max)

BONDING TEMP.

RT~300℃(Controller)

BONDING ACCURACY

±12~15㎛

TACT TIME

10~12sec(Bonding time 13sec)

BONDING PRESSURE

2.5~80kgf

ALIGNMENT

X, Y, Θmanual stage

PRESSURE METHOD

Micro Speed Cylinder (Ø50*20st) & Precise Regulator

UTILITY

MAIN POWER: 1Phase, 220V, 4.0KW, 50/60Hz

AIR : 5~6 Kg/cm2, 300L/min, Ø10 Hose