This machine is to attach the ACF which is the medium within panel and FPC, TAB and IC CHIP, on the panel.
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| Name |
ACF Bonder |
| Series | Module Line |
Product Description
Products of Yujin Discom
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Cell Line
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Auto Scribe (4Head)
Cell Line
-
Single Scribe
Cell Line
-
Filling Machine (Oil Pump)
Cell Line
-
END Seal Machine (3Head)
Cell Line
-
Cell Cleaning Machine (7Sump)
Cell Line
-
Large Machine
-
Polarizer Attach Machine (47")
Large Machine
-
TAB Bonder (47")
Large Machine
-
PCB Bonding Machine (47")
Large Machine
-
Semi COG Bonder (24")
Large Machine
-
Auto TAB Bonder (15")
Large Machine
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Module Line
-
Polarizer Cutting Machine
Module Line
-
Auto Polarizer Attach Machine
Module Line
-
Auto Polarizer Attach Machine (10.4")
Module Line
-
Polarizer Attach Machine
Module Line
-
Auto Visual Tester (AVT)
Module Line
-
Auto Clave (Ø550, Ø820)
Module Line
-
ACF Bonder
Module Line
-
Semi COG Bonder (2Head)
Module Line
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FPC Bonder (R-L)
Module Line
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FPC Bonder 4H-4S (R-L)
Module Line
-
FPC Bonder (Turn) 1H-2S
Module Line
-
FPC Bonder (Turn) 2H-4S
Module Line
-
Auto LCM Assembly Machine
Module Line
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The 1st Part Process
-
Seal Cure
The 1st Part Process
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TSP Line
-
Assembly Rolling Machine
TSP Line
-
Cell Laminator
TSP Line
-
Guide Hole Cutter
TSP Line
-
OCA Attach Machine
TSP Line
-
Sheet Assembly Machine
TSP Line