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Yujin Discom

LCD, OLED, PDP, VFD, Touch Panel Semi conductor equipment
Name

FPC Bonder (Turn) 1H-2S

Series Module Line
Product Description

This machine is to bond the ACF attached panel with FPC film after align, with heat and pressure. (Turn type, 1 head / 2 turn stage)
 

SPECIFICATIONS

EQUIP. DIMENSION

920(L)mm×650(W)mm×1770(H)mm

WEIGHT

220Kg

PANEL SIZE

16~75(W), 15~61(L) <3.5”max>

PANEL THICKNESS

(0.3~1.1)*2mm

1 FPC BONDING TIME (S/T)

20sec (bonding time 15sec 시)

FPC THICKNESS

0.1~0.2mm

PATTERN PITCH

0.1mm(max)

BONDING ACCURACY

±12~15 ㎛

EMPERATURE

Room Temperature ~ 350℃(controller 상)

UTILITY

MAIN POWER:220V±10%,1.2KW, 50/60Hz

AIR : 5~6 Kg/cm2, 240L/min, Ø10 Hose