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System Engineering Mega Solution

Semi conductor equipment, Display equipment and Material handling automation equipment manufacturer
Name

SEMBOND

Model SEMBOND
Series Semiconductor Equipment
Product Description

Overview

This machine is to attach chips on leadframes/PCBs at high speed.

 

Feature

Thin die handling without any die crack

- Using specialized patent air ejector
- Handling 25↑㎛ die thickness

High productivity and excellent accuracy

- 2-step bonding for thin & large size die
- Placement accuracy : ±15㎛@3σ (with under vision)
- 4M vision installation (substrate, under vision)
- High accurate dispenser unit