Overview
The 300mm single wafer processing equipment that is used for post CMP clean, PR strip, ashingless PR strip and metal removal processes.
Feature
Process Performance
- High Temperature SPM Process over 150℃
- PR Strip, Post CMP Clean, Metal Clean and etc.
Productivity / Hardware
- Contamination Free Clean by NIC Bowl
- H2SO4 Recycle System
- Energy Efficiency Rating : Class 1