Overview
The Single Wafer Wet Clean/PR Strip System for developing System LSI’s L1Xnm< device.
Feature
Process Performance
- High Grade Process (19nm)
- Defect Free Physical Cleaning
Productivity / Hardware
- Contamination Free Clean by NIC Bowl
- Leaning Free by CDA System
- SF-Aerosol : High-Velocity / Uniformity Droplet
- Smart System : APAC (Auto Flow Control), Smart Equipment Analysis System, Auto Inspection System
