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JINWOO ENGINEERING

Manufacturer of Automobile facility, Super precision welding facility, Measuring inspection facility, Electron gun production facility
Name

Wiring Thin Film Coater For TSP

Series Plasma Application
Product Description

Wiring Thin Film Coater For TSP

Equipment deposits Wiring Thin Film onto the parts’ surface by incorporating the Sputter & Thermal Heater method and is intended for Pattern Mo-Al-Mo & Phosphor-Bronze Plating of the G1F & G2 method implemented TSP used in Mobile Phones & Tablet PCs. 

JINWOO ENGINEERING Wiring Thin Film Coater For TSP

Features

1

High

User Friendly

1. Rotative & Orbital Load/Unloading
2. Magazine 12ea Load/Unloading

Production Capacity

1,080ea/1Hr, 4” based

2

Low

Temp

 

Operating Cost

 

Coefficient Of Friction

 

 

Specification

Works Space

L4500*D6500*H2700

Weight

4.5 Tons

Main

Chamber

Φ1,600*H1600

Source

Sputter+ Thermal Heater

Work Jig

Φ125 * 28 Axis

Pump

Diffusion Pump

20” 1 Set

Rotary & Booster Pump

gxs250 & EH2600

Vacuum Level

5*10-5torr

Option

Chiller

20RT

Poly Coldp

100,000L/Sec

 

Comparison

 

Wise-WTF 1600 (Batch Type)

In Line Type

Capa

Batch Time

60min

Long

Glass Size

4”

7”

10.1”

Optimized

1 Batch

1,080

320

192

Day [22Hr]

35,640

10,560

6,336

Month [26Day]

926,640

274,560

164,736

Deposition Temp

   

Target

Rotative & Orbital Magazine 12ea

Titanium Carrier