Wiring Thin Film Coater For TSP
Equipment deposits Wiring Thin Film onto the parts’ surface by incorporating the Sputter & Thermal Heater method and is intended for Pattern Mo-Al-Mo & Phosphor-Bronze Plating of the G1F & G2 method implemented TSP used in Mobile Phones & Tablet PCs.
Features |
|||
1 |
High |
User Friendly |
1. Rotative & Orbital Load/Unloading |
Production Capacity |
1,080ea/1Hr, 4” based |
||
2 |
Low |
Temp |
|
Operating Cost |
|||
Coefficient Of Friction |
Specification |
||
Works Space |
L4500*D6500*H2700 |
|
Weight |
4.5 Tons |
|
Main |
Chamber |
Φ1,600*H1600 |
Source |
Sputter+ Thermal Heater |
|
Work Jig |
Φ125 * 28 Axis |
|
Pump |
Diffusion Pump |
20” 1 Set |
Rotary & Booster Pump |
gxs250 & EH2600 |
|
Vacuum Level |
5*10-5torr |
|
Option |
Chiller |
20RT |
Poly Coldp |
100,000L/Sec |
Comparison |
|||||
Wise-WTF 1600 (Batch Type) |
In Line Type |
||||
Capa |
Batch Time |
60min |
Long |
||
Glass Size |
4” |
7” |
10.1” |
Optimized |
|
1 Batch |
1,080 |
320 |
192 |
||
Day [22Hr] |
35,640 |
10,560 |
6,336 |
||
Month [26Day] |
926,640 |
274,560 |
164,736 |
||
Deposition Temp |
|||||
Target |
Rotative & Orbital Magazine 12ea |
Titanium Carrier |