ARAF Coater

Sputter is used for multi-layer Array Plating of Si to add the Anti Reflect function. It is intended for Thin Plating of the Anti Finger liquid chemical on Glass surface of the Rabital Target.
The equipment is used to reduce Glass upper surface and reflection, improve Transmissivity, and prevent scratches caused by finger prints.
It is also used to form AR & AF Plating on tempered glasses such as for Smart Phones & Tablet PC.

JINWOO ENGINEERING ARAF Coater

Features
Size	High4,500 x 3,800 x 2369mm (6,000 x 6,500 x 2,500mm : Include Loading Zone)
Gross Weight	4,500kg
Equipment Specification	Compressed Air	Pressure	Min/Max, 6/8Kgf/㎠
	Compressed Air	Usage	20ℓ/min
	Cooling Water	Air cooling type detachable	25 RT, 2kgf/㎠, 5-25℃
	Cooling Water	Tank capacity	350ℓ
Utility	Electric Power	380V 3P 4W, 115kW
		Main distributing board : 175A_3 phase
		Power cable : 60SQ 3phase+Ground 16SQ _Single phase
	150

Specification
Substrate & Carrier	Substrate material	Tempered Glass
	Substrate size	[10.1" std.] 192ea / 1time process
	Tact Time	Less than 80 Min/ 1 time process
Vacuum	Ultimate pressure	5.0 x 10-5 torr↓
No Load (No specimen)	Vacuum exhaust speed	6min ↓ (ATM→ 5x10-2 torr)
Status	Vacuum exhaust speed	20min ↓ (ATM→ 5.0x10-5 torr)
Main	Chamber	Φ1,600*H1600
	Chamber	Φ1,600*H1600
	Source	Sputter+ Evaporation
Work Jig	Φ300 * 12 Axis
Pump	Diffusion Pump	20” 1 Set
	Rotary & Booster Pump	E2M275 & EH2600
	Vacuum Level	5*10-5torr
Option	Chiller	25RT
Option	Poly Cold	200,000L/Sec

Layout

Comparison
Description		AR AF-1600 Sputter ( Φ1,600 )			E-Beam AF ( Φ2,050 )
Capa	Batch Time	80min			45min
	Glass Size	4”	7”	10.1”	4”	7”	10.1”
	1 Batch	1,080	320	192	260	99	35
	Day [22Hr]	17,280	5,120	3,072	8,580	3,267	1,155
	Month [26Day]	449,280	133,120	79,872	223,080	84,942	30,030
Deposition Temp		25~35℃			80℃ or higher
Target		Rotative & Orbital Magazine 12ea			Dome