AF Coater
This equipment deposits Fluorine Chemical Compound on to the product surface using PeCVD & Thermal Evaporation method in addition to supplementing the adhesive Anti-Finger function.
It is intended for AF Plating on tempered glasses used on Smart Phones & Tablet PCs.
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Features |
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1 |
High |
User Friendly |
1. Rotative & Orbital Load/Unloading |
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Production Capacity |
4~6 times larger than E-Beam [Size] |
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2 |
Low |
Chamber Size |
3/4 of E-Beam |
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Temp (25~35˚) |
80℃ or higher than E-Beam |
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Operating Cost |
Lower Vacuum Pumping than E-Beam |
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Coefficient Of Friction |
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Specification |
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Works Space |
L4500*D6500*H2700 |
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Weight |
4.5 Tons |
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Main |
Chamber |
Φ1,600*H1600 |
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Source |
PeCVD+ Evaporation |
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Work Jig |
Φ300 * 12 Axis |
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Pump |
Diffusion Pump |
20” 1 Set |
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Rotary & Booster Pump |
E2M275 & EH2600 |
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Vacuum Level |
5*10-5torr |
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Option |
Chiller |
15RT |
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Poly Coldp |
100,000L/Sec |
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Layout |
 |
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Comparison |
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Wise AF-1600 PeCVD ( Φ1,600 ) |
E-Beam AF ( Φ2,050 ) |
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Capa |
Batch Time |
40min |
45min |
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Glass Size |
4” |
7” |
10.1” |
4” |
7” |
10.1” |
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1 Batch |
1,080 |
320 |
192 |
260 |
99 |
135 |
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Day [22Hr] |
35,640 |
10,560 |
6,336 |
8,580 |
3,267 |
1,155 |
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Month [26Day] |
926,640 |
274,560 |
164,736 |
223,080 |
84,942 |
30,030 |
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Deposition Temp |
25~35℃ |
80℃ or higher |
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Target |
Rotative & Orbital Magazine 12ea |
Dome |
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