Overview
ㆍSystem that uses low-temperature process water (PCW) to cool working fluid (colant, etc.) and absorb the heat arising from semiconductor and FPD manufacturing processes, supplying working fluid (coolant) at a constant temperature required in processes
ㆍAreas of application Etch, CVD, ALD etc.

Characteristics
ㆍHeat Exchanger Type(Multi Channel supported)
ㆍCan be used at high temperatures (30℃ ~ 200℃)
ㆍMinimal use of PCW through use of proportional valves
ㆍMinimal heater use
ㆍIncreased user convenience (use of Touch Screen)
ㆍVarious working fluids (Coolant, Water, Brine)