Overview
ㆍSystem of treating harmful gas to level below TLV by having them pass passes through the absorbent filling tank, thereby eliciting physical and chemical absorption.
ㆍAreas of application Metal Etching, Ion Implant process
Characteristics
ㆍHigh efficiency gas treatment
ㆍDesign for optimal gas discharge at TLV and below
ㆍLow overall CoO
ㆍ80 liter main cartridge
ㆍMini cartridge for bypass
ㆍPressure monitoring and safety device
ㆍInlet end pressure regulation with N2 Eductor
ㆍTemperature control monitoring and automatic N2 fuzzy function
Size
ㆍ650(W) x 540(D) x1650(H)
Utility
| Item | Type | Connection Type | |
| SDS | |||
| Electricity | 208VAC 1Phase 5A | 0.1KW | |
| CDA | 5 ~ 6.5 kg/㎠ | ¼” SS compression | |
| GN2 | 3 ~ 6 kg/㎠ | ¼” SS compression | |
| Gas Exhaust | -50 ~ -80㎜H2O | KF40 Flange | |
| Cabinet Exhaust | -30 ~ -60㎜H2O | Ø100 | |
