Overview
ㆍSystem for absorption of heat generated from the semiconductor and FPD manufacturing processes and to supply Working Fluid (Coolant) with consistent temperature required for the processes by cooling the Working Fluid (Coolant, etc.) with Refrigerant System
ㆍAreas of application Etch, Photo, ELA, Doping etc.
Characteristics
ㆍCompressor type (supports multiple channels)
ㆍBroad temperature band (-10℃ ~ 80℃)
ㆍVariable compressor capacity, with use of electric expansions valves (heatless system)
ㆍUse of eco-friendly refrigerants (Non CFC & HCFC)
ㆍIncreased user convenience (use of Touch Screen)
ㆍVarious working fluids (Coolant, Water, Brine)
Overview
ㆍSystem for supply of Working Fluid (Coolant) with consistent temperature in order to maintain low temperature(Chuck temperature : Min -55℃) of Wafer Prober Chuck required in the Wafer inspection equipment by cooling the Working Fluid(Coolant) by using Cascade Refrigerant System
ㆍAreas of application Wafer Prober Station
Characteristics
ㆍCascade Refrigerant System
ㆍBroad temperature band (Chuck temperature : -55℃ ~ 150℃)
ㆍCan be used for cold processes and hot processes
ㆍFast cooling time when transitioning between processes
ㆍIncreased user convenience (use of Touch Screen)
Overview
ㆍSystem for absorption of heat generated from the semiconductor and FPD manufacturing processes and to supply of Working Fluid (Coolant) with consistent temperature required for the process by cooling the Working Fluid(Coolant) by using Refrigerant System and low-temperature process water (PCW)
ㆍAreas of application Etch, Photo, ELA, Doping etc.
Characteristics
ㆍCompressor Type + Heat Exchanger Type(Multi Channel supported)
ㆍBroad temperature band (-10℃ ~ 80℃)
ㆍVariable compressor capacity, with use of electric expansions valves (heatless system)
ㆍMinimal use of PCW through use of proportional valves
ㆍUse of eco-friendly refrigerants (Non CFC & HCFC)
ㆍIncreased user convenience (use of Touch Screen)
ㆍVarious working fluids (Coolant, Water, Brine)
