Wafer Macro Inspection
▪ High throughput with dual lens system
▪ Chip inspection after sawing
▪ Kerf inspection
▪ Advanced D2D algorithm using golden die extracted from neighboring 4 dies
▪ Verifying review module included
▪ Self-developed lens for wide field of view and good resolution
▪ Real time auto focusing module adopted
▪ Optional IR inspection to inspect defects, cracks and chippings inside silicon.