Silicon Wafer

Processing equipment needed for the process through which silicon ingot important for solar cell production is made with wafers.

Seed Cutting Machine Cropping 1 axis Machine Cropping 2 axis Machine Squaring & Grinding Machine

- Tool : Diamond O.D Saw
- Seed Cutting : Cuts silicon ingot with seed rod through various processes
- Production of high-speed, multi-purpose and maximum quantities of seed rods

DAEOUNG MACHINERY Silicon Wafer

Processing Method

Seed Cutting

DAEOUNG MACHINERY Silicon Wafer 1

- Tool : Diamond O.D Saw
- Cropping : Cuts a specific or unnecessary part
- Sample Cutting : cutting of the sample of 1~2mm thick
- Compact, high-speed and multi-purpose cutting and processing

DAEOUNG MACHINERY Silicon Wafer 2

Processing Method

Cropping

DAEOUNG MACHINERY Silicon Wafer 3

- Tool : Diamond O.D Saw
- Top & Tail Cutting : Cuts both ends of silicon ingot
- Cropping : Cuts silicon ingot in fixed lengths
- Sample Cutting : Cuts the sample of 1~2mm thick
- High-speed and multi-purpose cutting and precision

DAEOUNG MACHINERY Silicon Wafer 4

Processing Method

Cropping

DAEOUNG MACHINERY Silicon Wafer 5

- Tool : Diamond O.D Saw & Diamond Cup Wheel
- Squaring : Cuts four sides of silicon ingot with a square brick
- Surface Grinding : Grinds a surface side squared in desired size and roughness
- Round Grinding : Cylindrical grinding of a irregular round side at a desired size
- High-speed, high-precision and loading & unloading auto processing

DAEOUNG MACHINERY Silicon Wafer 6