This equipment is a Reflow apparatus that performs soldering by heating and melting the cream solder printed on the printed circuit board under atmospheric environment in order to attach the surface mounted component onto the PCB. 
 Soldering capacity of Heat Blast Circulation Heater 8zone with turbo-fan installed at the top and the bottom minimizes the temperature differences between various devices, and enables formation of stabilized temperature ambience within the equipment, thereby enabling excellent reflow soldering and optimal condition for lead-soldering. 
 Heating format that uses specially processed Flat Panels with multiple pores and heat blast Heater provides outstanding functions and manipulability in setting of various conditions, thereby achieving excellent capabilities in SMT that requires high quality.