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Technology Soldering

Soldering equipment and Indoor water supply pipeline rehabilitation technology developer
Name

Reflow Machine (Lead Free)

Model ITM-3007LF
Series Soldering Equipment - Reflow Soldering M/C Lead Free
Product Description

Strong Point
1. Flux fume generated during reflow process normally cannot release and remain inside furmaces.
   Heat exchange unit located side wall for each furmace makes fume cool down and as liquid, and draw flux liquid to bottle for easy maintenance.
2. Operations can be done by PC, separeted from switch board.
3. Various differences in temperature between the device are decreased by hot air circulation heating of the up- down turbo fan.
4. A setup by the free combination of the pre-heating part and the re-flowing part is possible by the 8zones furnace composition.
5. Wide setup range by setting up each zone up-down heating temperatures independently.

Main Specifications (ITM-3007LF)
No.ITEMSPECIFICATION
1 PCB SIZE MIN 50(W)*70(L)mm*0.6t
 MAX 300(W)*330(L)mm*2.0t
2 Componet max hight 上, 下 20mm
3 Furnace 上, 下 8 Zone
4 Upper Heater 220v 1Ø 3.7Kw
5 Lower Heater 220v 1Ø 3.7Kw
6 PC Standard
7 The movement direction Left → Right
8 FL : PCB entrance Hight 900 ±20mm
9 Carrying conveyor 0.5~1.5m/min
10 Power supply 3相 220v 60Hz 65.5Kw
11 Dried air pressure More than 4~5kg f/㎠
12 Dimension 4950(L)*1350(W)*1445(H)
13 Total net weight 2500Kg
14 Type Stand-by Type
15 Option Center Bar UPS

Technology Soldering Reflow Machine (Lead Free) ITM-3007LF

Products of Technology Soldering