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Technology Soldering

Soldering equipment and Indoor water supply pipeline rehabilitation technology developer
Name

Reflow Machine (Lead Free)

Model ITM-3008LF
Series Soldering Equipment - Reflow Soldering M/C Lead Free
Product Description

Technology Soldering Reflow Machine (Lead Free) ITM-3008LF

Main Specifications (ITM-3008LF)
No.ITEMSPECIFICATION
1 PCB SIZE MIN 50(W)*70(L)mm*0.6t
 MAX 300(W)*330(L)mm*2.0t
2 Componet max hight 上, 下 20mm
3 Furnace 上, 下 8 Zone
4 Upper Heater 220v 1Ø 3.7Kw
5 Lower Heater 220v 1Ø 3.7Kw
6 PC Standard
7 The movement direction Left → Right
8 FL : PCB entrance Hight 900 ±20mm
9 Carrying conveyor 0.5~1.5m/min
10 Power supply 3相 220v 60Hz 65.5Kw
11 Dried air pressure More than 4~5kg f/㎠
12 Dimension 4950(L)*1350(W)*1445(H)
13 Total net weight 2500Kg
14 Type Stand-by Type
15 Option Center Bar UPS

Technology Soldering Reflow Machine (Lead Free) ITM-3008LF 1

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