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SemiMotto

Semi conductor equipment manufacturer, PCB, Solar cell manufacturing equipment, Industrial robot, Sensor and more
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IMG
Name

Wafer Thickness Gauge
Model SM-WT1001
Series Process Improvement System
Product Description

Product Description
 
This is the instrument for measuring the thickness of Wafer in the front and rear process of Backgrinding. 
  

Specification

Model SM - WT1001
Object Thickness of 8,12 inch Wafer
Chuck Porous - chuck
Measurement Sensor Contact or non-contact
Power AC 220V 1-P 50/60Hz
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