Product Description
WM3300 is a Semiautomatic system for tape laminating at wafer preparation process. The wafer mount tables consist of a wafer and ring-frame tables.
Specification
| Model | SM - WM3300 |
| Wafer Size | 12 Inch (allowable 6,8 ") |
| Dimension | 1000(L) *650(W)*500(H) mm |
| Power | 220V AC 1P 50/60 Hz |
| Weight | 30Kg |
| Air | 5 ~ 7 kg/㎠ |
Feature
- 6”, 8”,12” Wafer Capability
- Contact or Non-Contact Vacuum chuck (option)
- Air bubbles free mounting.
- Bonding pressure controllable(air pressure adjust)
- Bonding speed controllable(speed control motor driven)
- Blade Cutter unit (rotating type)
- Ionizer
- Non UV & UV Tape allowable.
- Wafer chuck temp controllable : up to 100℃
