Product Description
Wafer to Wafer's granding when the circuit breakers to protect and Wafer as a buffer to prevent Uv bumped wafer tape and apply the tape, etc. to prevent damage to the wafer tape may be bonded to the wafer.
Specification
| Model | SM - TL3100 |
| Wafer Size | 12 Inch |
| Tape Cutting Method | Blade |
| Processing | Visual C , Window Base |
| Productivity | 8 inch : 60 wafer/hr , 12 inch : 50 wafer/hr |
| Dimension | 1470 (L) x 1280 (W) x 2100(H) mm |
| Power | 220V AC 1 ? P 50/60 Hz |
| Air | 5 ~ 7 kg/㎠ |
| Other |
Robot transfer System Auto Wafer alignment |
Feature
- Fully Automatic Tape Laminator (UV Tape, non-UV tape)
- Tape Cutting Module (Blade Type)
- 5 axis Servo Motor Control Unit
- Tape Burr, Air Bubble None
- Robot / Aligner: Wafer Robot transfer / notch Check
- Temperature Control Heater
- Tape Tension Control
- Bonding Roller Air pressure adjustment
- Wafer Mapping
- Tape consumption minimizes
- Dual Wafer Load
