Vacuum Laminator

The equipment that install NCF on the Wafer without damage of Void, Thermal Strain, and Bump in 3D TSV Packaging processing and It also laminates film using by diaphragm expansion that is caused by air pressure difference in Vacuum Chamber.

Product descriptions

SPECIFICATION

· TYPE : FULL AUTO BUMPED
· WAFER SIZE(inch)
   : 8”, 12” Wafer 
   : 8”, 12” Wafer(With Ring Frame)
· DEMENSION(mm) : 1,990(W) * 2,580(D) * 2,220(H)
· WEIGHT : 1,100kg