Daesung Engineering

Semi conductor equipment manufacturer, Aero space equipment, Parts, Measuring equipment, UV curling machine, Lamp and more

Name	Auto BG Laminator
Series	Semiconductor

Product Description

Auto BG Laminator

The system is for laminating protection tape to the side of wafer pattern before Wafer Back Grinding Processing.

Product descriptions

Daesung Engineering Auto BG Laminator

SPECIFICATION

· TYPE : FULL AUTO THIN
· WAFER SIZE(inch) : 6”, 8”, 12”
· DEMENSION(mm) : 1,520(W) * 1,400(D) * 1,900(H)
· WEIGHT : 800kg

Products of Daesung Engineering

Auto BG Laminator