Description

SFA SEMICON’s Quad Flat Pack (QFP) is a leadframe based, plastic encapsulated package with gull wing shaped leads on four sides. The QFP is targeted at cost sensitive applications while providing a high degree of thermal and electrical performance. Offered in a wide range of body sizes and pin counts, the QFP provides designers with the flexibility and convenience of meeting their packaging needs for a large variety of device designs.

Application

ㆍProcessor, Controller, DSP, ASIC

ㆍVideo-DAC, PC Chip-Sets

ㆍGate Array

ㆍLogic, Multimedia

ㆍHome Appliances,

ㆍCommercial Commodity

ㆍAutomotive

Feature

ㆍJEDEC Standard compliance

ㆍDie stack Applicable

ㆍGreen materials (Pb-free / RoHS compliance)

ㆍLead pitch ≥ 0.65mm