SFA Semicon
Assembly and Test, Bumping, Packaging semi conductor manufacturing, Assembly, Inspection, Toll processing, Image analysis transport manufacturing
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Flip Chip
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FCBGA : Flip Chip Ball Grid Array
Flip Chip
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FCCSP : Flip Chip Chip Scale Package
Flip Chip
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Laminate
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FBGA : Fine-pitch Ball Grid Array
Laminate
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FBGA Stack Die : Fine-pitch Ball Grid Array Stack Die
Laminate
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PBGA : Plastic Ball Grid Array
Laminate
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SIP : System in Package
Laminate
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Lead Frame
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QFN : Quad Flat No Leads
Lead Frame
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TSOP : Thin Small Outline Package
Lead Frame
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SOP : Small Outline Package
Lead Frame
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DIP : Dual In-line Package
Lead Frame
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Lead Frame
TO-220
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QFP : Quad Flat Package
Lead Frame
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Storage
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Micro SD Card : Micro Secure Digital Card
Storage
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SD Card : Secure Digital Card
Storage
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WLCSP
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FO-WLP : Fan Out Wafer Level Package
WLCSP
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CoC, CoW : Chip on Chip, Chip on Wafer
WLCSP