SFA Semicon
Assembly and Test, Bumping, Packaging semi conductor manufacturing, Assembly, Inspection, Toll processing, Image analysis transport manufacturing
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sfasemicon_35730_mhzwum.pdf
FCBGA : Flip Chip Ball Grid Array
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sfasemicon_35729_dsvxdm.pdf
FCCSP : Flip Chip Chip Scale Package
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sfasemicon_35731_perpis.pdf
FBGA : Fine-pitch Ball Grid Array
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sfasemicon_35732_ifyjfq.pdf
FBGA Stack Die : Fine-pitch Ball Grid Array Stack Die
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sfasemicon_35734_pkwxuj.pdf
PBGA : Plastic Ball Grid Array
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sfasemicon_35733_iqxxrj.pdf
SIP : System in Package
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sfasemicon_35740_toixls.pdf
TO-220
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sfasemicon_35739_qabxkr.pdf
DIP : Dual In-line Package
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sfasemicon_35735_dcdqhl.pdf
QFN : Quad Flat No Leads
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sfasemicon_35738_pwiikj.pdf
QFP : Quad Flat Package
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sfasemicon_35737_gjrkmv.pdf
SOP : Small Outline Package
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sfasemicon_35736_zxwhnl.pdf
TSOP : Thin Small Outline Package
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sfasemicon_35741_bhqpqi.pdf
Micro SD Card : Micro Secure Digital Card
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sfasemicon_35742_ecocdf.pdf
SD Card : Secure Digital Card
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sfasemicon_35728_ebsvny.pdf
CoC, CoW : Chip on Chip, Chip on Wafer