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Die Bonder
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High-speed, high-accuracy die bonder for 8 inch wafer IC･LSI
Die Bonder
AD-100
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High-speed, high-accuracy die bonder for IC and LSI compatible with 8, 12 inch wafers.
Die Bonder
AD-200
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High-accuracy & High Production die bonder for Stacked NAND flash compatible with 12 inch wafers.
Die Bonder
AD-300
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High performance FO-PLP BONDER
Die Bonder
AD-400
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Lamination
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Tape Full Auto Lamination For Cell
Lamination
ALM-100