Basic Information
Model name : AD-300
High-accuracy & High Production die bonder for Stacked NAND flash compatible with 12 inch wafers.
Features
1.High productivity : UPH 7K (B’g time 0.5s , dual two in one concept)
2.Single lane(standard) , Dual lane(option) : Bin 1 & Bin 2 division bonding
3.High placement accuracy : ±10㎛@3σ
4.Thin die bonding technology
Patented slide ejector
Multi step ejector compatible
Min thickness 20㎛
5. 100class cleanness of FFU
6.Auto device change
Auto tool change : Bond, Pickup tool Ultra thin die thickness : Min 20㎛
7.OHT automation
8.Wafer auto change system
Main Specs
| Bonding Method | Epoxy bonding / DAF Tape |
| Bonding Speed | 0.5sec/cycle |
| Bonding Accuracy | XY : ±10μm,3σ θ : ±0.05°,3σ |
| Die Size | Ø5.0-25.0mm t＝30μm- |
| Substrate Size | Length : 100–300 mm Width : 30–102 mm |
| Magazine Size | Length : 100–315 mm Width : 30–115 mm Thickness : 50–200 mm |
| Wafer Size | Max 12 inch |
| Power requirements | Power supply : AC 220 V 30 A |
| Dry air | 0.5 MPa (60 L/min) |
| Vacuum | -80 KPa (100 L/min) |
| Dimensions | (W) 2,160 × (D) 1,470 × (H) 1,600 mm |
| Weight | Approximately 2,500 kg |
Options
| Optional Functions | Dual lane Ionizer blower Needleless pickup unit Wafer mapping Secs & gem FFU / ATC / OHT |
