Basic Information
Model name : AD-100
High-speed, high-accuracy die bonder for 8 inch wafer IC･LSI
Features
1.Small footprint.
2.Best Quality of Patented controller(syringe 5cc, 10cc, option 30cc~).
3.Flexible Wide range of lead frame compatibility Lead frame size: W 102 mm × L 300 mm.
4.Single or twin dispensing system Compatible with a variety of pastes, stable application performance.
5.High-accuracy small die pickup Φ0.15–8.0 mm compatibility.
6. Wafer auto change system
Main Specs
| Main Specs | Epoxy bonding |
| Bonding Speed | 0.18sec/cycle |
| Bonding Accuracy | XY : ±25μm,3σ θ : ±1°,3σ(Φ1.0mm or above) θ : ±3°,3σ(under Φ1.0mm) |
| Die Size | Ø0.2-Φ8.0mm t＝0.1-0.5mm Option : Φ0.15-Ø2.0mm |
| Lead frame Size | Length : 50-260mm(up to 300 mm in option) Width : 30-102mm Thickness : 0.1-1.5mm |
| Magazine Size | Length : 50-260mm(up to 300 mm in option) Width : 30-110mm Thickness : 50-200mm |
| Wafer Size | Max Ø8 inch |
| Power requirements | Power supply: AC 220 V / 30 A Dry air: 0.4 MPa (60 L/min) Vacuum: -70 KPa (100 L/min) |
| Dimensions | (W) 1,650 × (D) 1,200 × (H) 1,500mm |
| Weight | Approximately 1,500 kg |
Options
| Optional Functions | Magazine stacker loader Twin dispenser Ionizer blower Substrate height laser sensor Wafer mapping FFU |
