Basic Information
Model name : AD-200
High-speed, high-accuracy die bonder for IC and LSI compatible with 8, 12 inch wafers.
Features
1.High quality / High productivity : two in one concept.
Use of intermediate stage ensures high quality and high productivity.
2.Best Quality of Patented paste controller(syringe 5cc, 10cc, option 30cc~).
3.Applied Force Control of Air Actuator.
4.Applied High Speed linear motor system.
5.Real time pre/post Inspection System 6.High-accuracy small die pickup Min 0.2mm compatibility.
7.Thin die bonding technology
Patented slide ejector
Multi step ejector compatible
Min thickness 20㎛
8. 100class cleanness of FFU
9. Wafer auto change system
Main Specs
| Bonding Method | Epoxy bonding / DAF Tape |
| Bonding Speed | 0.35sec/cycle |
| Bonding Accuracy | Epoxy : XY ± 20 μm , 3σ DAF : XY ± 10 μm , 3σ |
| Bonding Force | 0.5~30N(Option 50N) |
| Lead frame Size | Length : 100–300 mm Width : 30–102 mm Thickness : 0.075–2.0 mm |
| Magazine Size | Length : 100–315 mm Width : 30–115 mm Thickness : 50–200 mm |
| Wafer Size | 8/12 inch |
| Power requirements | Power supply : AC 220 V 30 A |
| Dry air | 0.4 MPa (60 L/min) |
| Vacuum | -70KPa (100 L/min) |
| Dimensions | (W) 1,930 × (D) 1,400 × (H) 1,600 mm |
| Weight | Approximately 2,000 kg |
Options
| Optional Functions | Two in one die stage unit Magazine stacker loader Needleless pickup unit Polishing cover Wafer mapping SECS & GEM FFU |
