Product Description
The model WD 5000 is Compositive Equipmennt That Can Operate Function of Film Mounting and De-Taping for 8 inch, 12 inch Wafer.
It Is Made up Wafer Cassette Loading,Wafer Aligner,Wafer Transfer,De-taping,Rail Ass'y& Un-loading,Wafer Frame Casette Elevator and Wafer Chuck Ass'y.
Specification
| Model | SD - WD5000 |
| Cutting | Long Life Tape Cut Blade : Tape Cutting Speed Is Programmable |
| Wafer Availabliity | 8 inch : 6 mil 이상 , 12 inch : 8 mil 이상 |
| Wafer Warpage Capability | 15.0 mm |
| Wafer Mounting Repeatability | 0.5 mm 이내 |
| Productivity |
8 inch : 50 sheets/hrs 12 inch : 40 sheets/hrs |
| Up time | 98% 이상 |
| Power | 220VAC,3 phase,60Hz |
| Dimension | 1900(L) X 1850(W) X 1800 (H) mm |
| Weight | 1800 kg |
| Operation System | Window base |
| Air pressure | 5kg/ ㎠ |
| Other | Ionizer , N ₂ Gas : Available |
Feature
- Wafer Mounting & De-taping equipment, featuring complex
- No Wafer Damage (Non Contact Wafer Mounting)
- Air Bubble Free Mounting
- Controlled Tape Tension
- Uv Tape Capability
