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SemiMotto

Semi conductor equipment manufacturer, PCB, Solar cell manufacturing equipment, Industrial robot, Sensor and more
Name

Flip Chip Cleaning System (Maga Sonic Type)

Series Semiconductor
Product Description

Product Description

This facility remains in material FLIP CHIP FLUX RMA FLUX and water and other debris CHEMICAL SPRAY & MAGA SONIC CLEANING using an ultrasonic SYSTEM  
  

Specification

▶ FACILITIES
ㆍPOWER; AC 380V 3Ø 130A , 50~60HZ
ㆍHOT D.I WATER ; 50℃~ 70℃  

▶ IN LET (BELT TYPE FORMAT)
ㆍ3 ROWS 
ㆍBELT SPEED : 0.3 -0.6 M/Min (Normal) 

▶ Fluid : CHEMICAL(A4520) & D.I WATER
▶ FLIP CHIP BUMP GAP : 20 -100 μ
▶ CONVEYOR SPEED ; 0.5 M (Normal), 1M/min (Max)
▶ MAGA SONIC by ultrasonic cleaning or high pressure pump (10HP) 3 type of spray
▶ AIR BLOW ZONE
▶ Equipment : 4720 mm L , 1350 mm W , 1520 mmH


- User Management System for easy transport 
- DI water purity Check System - the pressure SYSTEM
- Reduces excessive water usage. 
- Open the front panel

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