ㆍCutting speed 2 to 10 times faster than the PWS-R type
ㆍImprovement of working conditions due to use of water soluble cutting fluid
ㆍImprovement of environment due to separate collection of chip from wastes
ㆍVarious specifications available
USE
ㆍCutting of glass, ceramics, quartz, sapphire and other brittle materials
ㆍCutting of silicon ingots for semiconductor devices and solar cells
ㆍCutting of magnetic materials such as neodymium and ferrite magnets
ㆍCutting of various ingots, SiC and substrates
Specifications
| Products | Core Wire | Dia Size | Note |
|---|---|---|---|
| 0.25mm | 0.18mm | 30 ~ 40 ㎛ | Quantity of winding wire can be adjustable |
