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NewmaTech

Semi conductor chip material processor, Slicing, Wrapping, Polishing, Abrasive, Subsidiary materials
Model WSD-K2
Series Multi Wire Saw
Product Description

ㆍBest suited for sample wafering with the use of Diamond wire  

ㆍHigh precision slicing achieved by high wire tensioning &Takatori Original Rocking System  

ㆍSimple mechanical design and easy oeration with the use of Touch Panel Operation Screen  

ㆍReasonably priced for labs and evaluation purposes        

 

Max Work Size(W*H*L) 156*156*100
Max. wire speed 500m/min
Rocking angle 0 ~±10
Wire Tension 40N
machine Dimensions(W*H*L) 1000*1750*1100