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MIS

Semi conductor manufacturing equipment manufacturer, Auto Decaper, Track System, Vacuum Valve and more
Name

MIS Mill Etch

Model DM-07
Series Semiconductor Equipment
Product Description

Function & Features 

 
- Using End mill for the milling of EMC 
- Fast, safe, and accurate milling work
- Prompt and accurate milling by robot motions (Average   milling time < 1 min.) 
- Robot motion (X, Y, Z axis) having the precision of minimum 0.01mm (10㎛) 
- Automatically recognizing the height of the sample surface through a sensor and doing the milling work 
- Providing various sizes of end mills (Φ1.0, Φ2.0, Φ3.0 mm)
- Very effective for the removal of metal surface 
- Reducing the molding (EMC) thickness, which makes the decapsulation work finished fast 
- Providing the guide well for etching zones 
- Backside milling which is effective for removing PCB and molding

 

Specification

Item Description
Dimension 430(W) x 575(D) x 620(H) mm
Weight Approx. 80 kg
Procedure Milling
Handling IC Size 2x2 mm ~ 80x80 mm (Minimum Milling Depth : Approx. 0.01 mm)
Cleaning System Vacuum Cleaner (Option)
Process Time 1~2 min.(Average Time)
Utility Roted Voltage : AC 220V/110V, 1 Phase
Roted Current : 15A
Roted Frequency : 50 ~ 60 Hz
Air Pressure : 6kg/㎠ (bar)
Program Microprocessor Control Panel