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EO TECHNICS

Laser processing equipment manufacturer, Laser marking M/C for semi conductor, Driller, PCB via hole and more
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IMG
Name

Grooving & Dicing Equipment
Model LMC3200
Series Semiconductor
Product Description

Grooving & Dicing

- LMC3200G with DPSS laser removes the low-k and metal layer which lower the yield rate on the saw blade process.
  It improves the quality and productivity of the singulation process.

- LMC3200D is a system for thin wafer dicing.
  It is better than mechanical blade type; It doesn’t need to replace blade and reduces wafer chipping in the processing. 

EO TECHNICS Grooving & Dicing Equipment LMC3200

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