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EO TECHNICS

Laser processing equipment manufacturer, Laser marking M/C for semi conductor, Driller, PCB via hole and more
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IMG
Name

Drilling Equipment
Model BMC204P
Series Semiconductor
Product Description

Drilling

BMC204P is package drilling equipment for the strip and wafer types.
Its automatic inspection and scanner correction functions make the process highly accurate.
The equipment has align and post inspection vision, and provides on-the-fly method to increase processing efficiency.

EO TECHNICS Drilling Equipment BMC204P

Products of EO TECHNICS