Synapse Imaging

Semi conductor inspection system manufacturer, Inspection equipment, Measuring equipment, SMT, Wafer, FPP panel

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Name	FC Bump Inspection System
Series	PCB

Product Description

FC Bump Inspection System is a type of equipment designed for inspecting the quality of FC bumps printed in the manufacturing processes of flip chip bump substrates or packages, and the quality of bumps is inspected by measuring the height, diameters, X/Y positions and etc., before and after a printing process.
Synapse Imaging FC Bump Inspection System